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Electroless copper plating

United States Patent

December 15, 1998
View the Complete Patent at the US Patent & Trademark Office
Sandia National Laboratories - Visit the Intellectual Property Management and Licensing Website
An optimized electroless copper plating technique suitable for plating electroless copper upon ceramics.
McHenry; Michael R. (Lee's Summit, MO)
AlliedSignal Inc. (Morristown, NJ)
08/ 717,195
September 18, 1996
This invention is entitled to priority due to provisional U.S. application Ser. No. 60/034,313, filed Sep. 25, 1995 (original regular application Ser. No. 08/533,248, converted to provisional Sep. 12, 1996) and provisional U.S. application Ser. No. 06/005,946, filed Oct. 27, 1995. The U.S. Government has rights in this invention pursuant to contract number DE-AC04-76-DP00613 with the United States Department of Energy.