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Solderability test system

United States Patent

*** EXPIRED ***
October 27, 1998
View the Complete Patent at the US Patent & Trademark Office
Sandia National Laboratories - Visit the Intellectual Property Management and Licensing Website
A new test method to quantify capillary flow solderability on a printed wiring board surface finish. The test is based on solder flow from a pad onto narrow strips or lines. A test procedure and video image analysis technique were developed for conducting the test and evaluating the data. Feasibility tests revealed that the wetted distance was sensitive to the ratio of pad radius to line width (l/r), solder volume, and flux predry time.
Yost; Fred (Cedar Crest, NM), Hosking; Floyd M. (Albuquerque, NM), Jellison; James L. (Albuquerque, NM), Short; Bruce (Beverly, MA), Giversen; Terri (Beverly, MA), Reed; Jimmy R. (Austin, TX)
Sandia National Laboratories (Albuquerque, NM)
08/ 426,543
April 21, 1995
The government has rights in this invention pursuant to Contract No. DE-AC04-76DP00789 awarded by the U.S. Department of Energy.