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Fabricating cooled electronic system with liquid-cooled cold plate and thermal spreader

United States Patent

March 27, 2018
View the Complete Patent at the US Patent & Trademark Office
Methods are provided for facilitating cooling of an electronic component. The method includes providing a liquid-cooled cold plate and a thermal spreader associated with the cold plate. The cold plate includes multiple coolant-carrying channel sections extending within the cold plate, and a thermal conduction surface with a larger surface area than a surface area of the component to be cooled. The thermal spreader includes one or more heat pipes including multiple heat pipe sections. One or more heat pipe sections are partially aligned to a first region of the cold plate, that is, where aligned to the surface to be cooled, and partially aligned to a second region of the cold plate, which is outside the first region. The one or more heat pipes facilitate distribution of heat from the electronic component to coolant-carrying channel sections of the cold plate located in the second region of the cold plate.
Chainer; Timothy J. (Putnam Valley, NY), Graybill; David P. (Staatsburg, NY), Iyengar; Madhusudan K. (Foster City, CA), Kamath; Vinod (Raleigh, NC), Kochuparambil; Bejoy J. (Apex, NC), Schmidt; Roger R. (Pougkeepsie, NY), Steinke; Mark E. (Durham, NC)
14/ 562,879
December 8, 2014
STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH This invention was made with Government support under Contract No. DE-EE0002894, awarded by the Department of Energy. Accordingly, the U.S. Government has certain rights in the invention.