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Power module assembly with reduced inductance

United States Patent

9,917,065
March 13, 2018
View the Complete Patent at the US Patent & Trademark Office
A power module assembly has a plurality of electrically conducting layers, including a first layer and a third layer. One or more electrically insulating layers are operatively connected to each of the plurality of electrically conducting layers. The electrically insulating layers include a second layer positioned between and configured to electrically isolate the first and the third layers. The first layer is configured to carry a first current flowing in a first direction. The third layer is configured to carry a second current flowing in a second direction opposite to the first direction, thereby reducing an inductance of the assembly. The electrically insulating layers may include a fourth layer positioned between and configured to electrically isolate the third layer and a fifth layer. The assembly results in a combined substrate and heat sink structure. The assembly eliminates the requirements for connections between separate substrate and heat sink structures.
Ward; Terence G. (Waterford, MI), Stancu; Constantin C. (Auburn Hills, MI), Jaksic; Marko (Rochester Hills, MI), Mann; Brooks S. (Royal Oak, MI)
GM Global Technology Operations LLC (Detroit, MI)
15/ 260,858
20180076153
September 9, 2016
STATEMENT REGARDING FEDERALLY-SPONSORED RESEARCH OR DEVELOPMENT This invention was made with Government support under Award No. DE-EE-0007285, awarded by Department of Energy-National Energy Tech Lab (NETL). The United States Government may have certain rights in this invention.