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Hybrid chip-on-board LED module with patterned encapsulation

United States Patent

9,905,737
February 27, 2018
View the Complete Patent at the US Patent & Trademark Office
Different wavelength conversion materials, or different concentrations of a wavelength conversion material are used to encapsulate the light emitting elements of different colors of a hybrid light emitting module. In an embodiment of this invention, second light emitting elements (170) of a particular color are encapsulated with a transparent second encapsulant (120;420;520), while first light emitting elements (160) of a different color are encapsulated with a wavelength conversion first encapsulant (110;410;510). In another embodiment of this invention, a particular second set of second and third light emitting elements (170,580) of different colors is encapsulated with a different encapsulant than another first set of first light emitting elements (160).
Soer; Wouter Anthon (Palo Alto, CA), Helbing; Rene (Palo Alto, CA), Huang; Guan (San Jose, CA)
Lumileds LLC (San Jose, CA)
15/ 106,667
20160329472
August 26, 2014
This invention was made with U.S. Government support under Contract No. DE-EE0005099 awarded by the Department of Energy (DOE). The Government has certain rights in this invention.