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Method of accurate thickness measurement of boron carbide coating on copper foil

United States Patent

November 7, 2017
View the Complete Patent at the US Patent & Trademark Office
A method is disclosed of measuring the thickness of a thin coating on a substrate comprising dissolving the coating and substrate in a reagent and using the post-dissolution concentration of the coating in the reagent to calculate an effective thickness of the coating. The preferred method includes measuring non-conducting films on flexible and rough substrates, but other kinds of thin films can be measure by matching a reliable film-substrate dissolution technique. One preferred method includes determining the thickness of Boron Carbide films deposited on copper foil. The preferred method uses a standard technique known as inductively coupled plasma optical emission spectroscopy (ICPOES) to measure boron concentration in a liquid sample prepared by dissolving boron carbide films and the Copper substrates, preferably using a chemical etch known as ceric ammonium nitrate (CAN). Measured boron concentration values can then be calculated.
Lacy; Jeffrey L. (Houston, TX), Regmi; Murari (Houston, TX)
Proportional Technologies, Inc. (Houston, TX)
14/ 938,903
November 12, 2015
GOVERNMENTAL SPONSORSHIP This invention was made with support under DE-SC0009615 awarded by the Department of Energy. The government may have certain rights in the invention.