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Printed assemblies of ultrathin, microscale inorganic light emitting diodes for deformable and semitransparent displays

United States Patent

May 9, 2017
View the Complete Patent at the US Patent & Trademark Office
Described herein are printable structures and methods for making, assembling and arranging electronic devices. A number of the methods described herein are useful for assembling electronic devices where one or more device components are embedded in a polymer which is patterned during the embedding process with trenches for electrical interconnects between device components. Some methods described herein are useful for assembling electronic devices by printing methods, such as by dry transfer contact printing methods. Also described herein are GaN light emitting diodes and methods for making and arranging GaN light emitting diodes, for example for display or lighting systems.
Rogers; John A. (Champaign, IL), Nuzzo; Ralph (Champaign, IL), Kim; Hoon-sik (Champaign, IL), Brueckner; Eric (Champaign, IL), Park; Sang Il (Savoy, IL), Kim; Rak Hwan (Champaign, IL)
The Board of Trustees of the University of Illinois (Urbana, IL)
14/ 479,100
September 5, 2014
STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT This invention was made with United States governmental support under Award Nos. DE-FG02-07ER46471 and DE-FG02-07ER46453 awarded by the U.S. Department of Energy and Award No. DMI-0328162 awarded by the National Science Foundation. The U.S. government has certain rights in the invention.