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Printing transferable components using microstructured elastomeric surfaces with pressure modulated reversible adhesion

United States Patent

August 9, 2016
View the Complete Patent at the US Patent & Trademark Office
In a method of printing a transferable component, a stamp including an elastomeric post having three-dimensional relief features protruding from a surface thereof is pressed against a component on a donor substrate with a first pressure that is sufficient to mechanically deform the relief features and a region of the post between the relief features to contact the component over a first contact area. The stamp is retracted from the donor substrate such that the component is adhered to the stamp. The stamp including the component adhered thereto is pressed against a receiving substrate with a second pressure that is less than the first pressure to contact the component over a second contact area that is smaller than the first contact area. The stamp is then retracted from the receiving substrate to delaminate the component from the stamp and print the component onto the receiving substrate. Related apparatus and stamps are also discussed.
Menard; Etienne (Durham, NC), Rogers; John A. (Champaign, IL), Kim; Seok (Urbana, IL), Carlson; Andrew (Urbana, IL)
Semprius, Inc. (Durham, NC), The Board of Trustees of the University of Illinois (Urbana, IL)
13/ 237,375
September 20, 2011
STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT This invention was made, at least in part, with United States governmental support by a National Security Science and Engineering Faculty Fellowship and the U.S. Department of Energy, Division of Materials Sciences under Award No. DEFG02-91ER45439. The United States Government has certain rights in this invention.