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Cooling system for electronic components

United States Patent

December 15, 2015
View the Complete Patent at the US Patent & Trademark Office
Embodiments of the present invention provide for non interruptive fluid cooling of an electronic enclosure. One or more electronic component packages may be removable from a circuit card having a fluid flow system. When installed, the electronic component packages are coincident to and in a thermal relationship with the fluid flow system. If a particular electronic component package becomes non-functional, it may be removed from the electronic enclosure without affecting either the fluid flow system or other neighboring electronic component packages.
Anderl; William James (Rochester, MN), Colgan; Evan George (Chestnut Ridge, NY), Gerken; James Dorance (Zumbro Falls, MN), Marroquin; Christopher Michael (Rochester, MN), Tian; Shurong (Mount Kisco, NY)
International Business Machines Corporation (Armonk, NY)
13/ 781,837
March 1, 2013
This invention was made with Government support under Contract No.: B554331 awarded by Department of Energy. The Government has certain rights in this invention.