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Method of fabricating high-density hermetic electrical feedthroughs

United States Patent

June 2, 2015
View the Complete Patent at the US Patent & Trademark Office
Lawrence Livermore National Laboratory - Visit the Industrial Partnerships Office Website
A method of fabricating electrical feedthroughs selectively removes substrate material from a first side of an electrically conductive substrate (e.g. a bio-compatible metal) to form an array of electrically conductive posts in a substrate cavity. An electrically insulating material (e.g. a bio-compatible sealing glass) is then flowed to fill the substrate cavity and surround each post, and solidified. The solidified insulating material is then exposed from an opposite second side of the substrate so that each post is electrically isolated from each other as well as the bulk substrate. In this manner a hermetic electrically conductive feedthrough construction is formed having an array of electrical feedthroughs extending between the first and second sides of the substrate from which it was formed.
Shah; Kedar G. (San Francisco, CA), Pannu; Satinderpall S. (Pleasanton, CA), Delima; Terri L. (Livermore, CA)
Lawrence Livermore National Security, LLC (Livermore, CA)
14/ 009,332
April 18, 2012
FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT The United States Government has rights in this invention pursuant to Contract No. DE-AC52-07NA27344 between the United States Department of Energy and Lawrence Livermore National Security, LLC for the operation of Lawrence Livermore National Laboratory.