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Release strategies for making transferable semiconductor structures, devices and device components

United States Patent

November 25, 2014
View the Complete Patent at the US Patent & Trademark Office
Provided are methods for making a device or device component by providing a multilayer structure having a plurality of functional layers and a plurality of release layers and releasing the functional layers from the multilayer structure by separating one or more of the release layers to generate a plurality of transferable structures. The transferable structures are printed onto a device substrate or device component supported by a device substrate. The methods and systems provide means for making high-quality and low-cost photovoltaic devices, transferable semiconductor structures, (opto-)electronic devices and device components.
Rogers; John A. (Champaign, IL), Nuzzo; Ralph G. (Champaign, IL), Meitl; Matthew (Raleigh, NC), Ko; Heung Cho (Urbana, IL), Yoon; Jongseung (Urbana, IL), Menard; Etienne (Durham, NC), Baca; Alfred J. (Urbana, IL)
The Board of Trustees of the University of Illinois (Urbana, IL)
13/ 071,027
March 24, 2011
STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT This invention was made with government support under Grant DEFG02-91-ER45439 awarded by Department of Energy. The government has certain rights in the invention.