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Sealed substrate carrier for electroplating

United States Patent

July 17, 2012
View the Complete Patent at the US Patent & Trademark Office
One embodiment relates to a substrate carrier for use in electroplating a plurality of substrates. The substrate carrier includes a non-conductive carrier body on which the substrates are held, and conductive lines are embedded within the carrier body. A conductive bus bar is embedded into a top side of the carrier body and is conductively coupled to the conductive lines. A thermoplastic overmold covers a portion of the bus bar, and there is a plastic-to-plastic bond between the thermoplastic overmold and the non-conductive carrier body. Other embodiments, aspects and features are also disclosed.
Ganti; Kalyana Bhargava (Fremont, CA)
SunPower Corporation (San Jose, CA)
12/ 889,228
September 23, 2010
STATEMENT OF FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT The invention described herein was made with Governmental support under contract number DE-FC36-07GO17043 awarded by the United States Department of Energy. The Government may have certain rights in the invention.