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Vitreous carbon mask substrate for X-ray lithography

United States Patent

October 27, 2009
View the Complete Patent at the US Patent & Trademark Office
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The present invention is directed to the use of vitreous carbon as a substrate material for providing masks for X-ray lithography. The new substrate also enables a small thickness of the mask absorber used to pattern the resist, and this enables improved mask accuracy. An alternative embodiment comprised the use of vitreous carbon as a LIGA substrate wherein the VC wafer blank is etched in a reactive ion plasma after which an X-ray resist is bonded. This surface treatment provides a surface enabling good adhesion of the X-ray photoresist and subsequent nucleation and adhesion of the electrodeposited metal for LIGA mold-making while the VC substrate practically eliminates secondary radiation effects that lead to delamination of the X-ray resist form the substrate, the loss of isolated resist features, and the formation of a resist layer adjacent to the substrate that is insoluble in the developer.
Aigeldinger; Georg (Livermore, CA), Skala; Dawn M. (Fremont, CA), Griffiths; Stewart K. (Livermore, CA), Talin; Albert Alec (Livermore, CA), Losey; Matthew W. (Livermore, CA), Yang; Chu-Yeu Peter (Dublin, CA)
Sandia Corporation (Livermore, CA)
11/ 192,797
July 28, 2005
STATEMENT OF GOVERNMENT SUPPORT The United States Government has rights in this invention pursuant to Contract No. DE-AC04-94AL85000 between the United States Department of Energy and Sandia Corporation for the operation of Sandia National Laboratories.