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Electrical assembly having heat sink protrusions

United States Patent

April 21, 2009
View the Complete Patent at the US Patent & Trademark Office
An electrical assembly, comprising a heat producing semiconductor device supported on a first major surface of a direct bond metal substrate that has a set of heat sink protrusions supported by its second major surface. In one preferred embodiment the heat sink protrusions are made of the same metal as is used in the direct bond copper.
Rinehart; Lawrence E. (Lake Oswego, OR), Romero; Guillermo L. (Phoenix, AZ)
Rinehart Motion Systems, LLC (Wilsonville, OR)
11/ 017,184
December 18, 2004
STATEMENT OF GOVERNMENT SUPPORT This invention was made with government support under grant no DE-FG02-03ER83768, awarded by the Department of Energy. The government has certain rights in the invention.