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Thermally stable diamond brazing

United States Patent

February 10, 2009
View the Complete Patent at the US Patent & Trademark Office
A cutting element and a method for forming a cutting element is described and shown. The cutting element includes a substrate, a TSP diamond layer, a metal interlayer between the substrate and the diamond layer, and a braze joint securing the diamond layer to the substrate. The thickness of the metal interlayer is determined according to a formula. The formula takes into account the thickness and modulus of elasticity of the metal interlayer and the thickness of the TSP diamond. This prevents the use of a too thin or too thick metal interlayer. A metal interlayer that is too thin is not capable of absorbing enough energy to prevent the TSP diamond from fracturing. A metal interlayer that is too thick may allow the TSP diamond to fracture by reason of bending stress. A coating may be provided between the TSP diamond layer and the metal interlayer. This coating serves as a thermal barrier and to control residual thermal stress.
Radtke; Robert P. (Kingwood, TX)
11/ 130,036
May 16, 2005
This invention was made with government support under contract #DE-FC26-97FT34368 awarded by the Department of Energy. The government has certain rights in this invention.