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System configured for applying a modifying agent to a non-equidimensional substrate

United States Patent

July 10, 2007
View the Complete Patent at the US Patent & Trademark Office
Idaho National Laboratory - Visit the Technology Deployment Office Website
The present invention is related to systems and methods for modifying various non-equidimensional substrates with modifying agents. The system comprises a processing chamber configured for passing the non-equidimensional substrate therethrough, wherein the processing chamber is further configured to accept a treatment mixture into the chamber during movement of the non-equidimensional substrate through the processing chamber. The treatment mixture can comprise of the modifying agent in a carrier medium, wherein the carrier medium is selected from the group consisting of a supercritical fluid, a near-critical fluid, a superheated fluid, a superheated liquid, and a liquefied gas. Thus, the modifying agent can be applied to the non-equidimensional substrate upon contact between the treatment mixture and the non-equidimensional substrate.
Janikowski; Stuart K. (Idaho Falls, ID), Argyle; Mark D. (Idaho Falls, ID), Fox; Robert V. (Idaho Falls, ID), Propp; W. Alan (Idaho Falls, ID), Toth; William J. (Idaho Falls, ID), Ginosar; Daniel M. (Idaho Falls, ID), Allen; Charles A. (Idaho Falls, ID), Miller; David L. (Idaho Falls, ID)
Battelle Energy Alliance, LLC (Idaho Falls, ID)
10/ 627,530
July 24, 2003
CONTRACTUAL ORIGIN OF THE INVENTION The United States Government has certain rights in this invention pursuant to Contract Nos. DE -AC07-94ID13223, DE-AC07-99ID13727, and Contract No. DE-AC07-05ID14517 between the United States Department of Energy and Battelle Energy Alliance, LLC.