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Resistivity analysis

United States Patent

June 13, 2006
View the Complete Patent at the US Patent & Trademark Office
Sandia National Laboratories - Visit the Intellectual Property Management and Licensing Website
According to an example embodiment of the present invention a semiconductor die having a resistive electrical connection is analyzed. Heat is directed to the die as the die is undergoing a state-changing operation to cause a failure due to suspect circuitry. The die is monitored, and a circuit path that electrically changes in response to the heat is detected and used to detect that a particular portion therein of the circuit is resistive. In this manner, the detection and localization of a semiconductor die defect that includes a resistive portion of a circuit path is enhanced.
Bruce; Michael R. (Austin, TX), Bruce; Victoria J. (Austin, TX), Ring; Rosalinda M. (Austin, TX), Cole; Edward Jr. I. (Albuquerque, NM), Hawkins; Charles F. (Albuquerque, NM), Tangyungong; Paiboon (Albuquerque, NM)
Advance Micro Devices, Inc. (Sunnyvale, CA)
09/ 586,518
June 2, 2000
GOVERNMENT RIGHTS This invention was made with U.S. Government support under Contract No. DE-AC04-94AL85000 awarded by the U.S. Department of Energy. The U.S. Government has certain rights in the invention.