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Programmable multi-chip module

United States Patent

November 16, 2004
View the Complete Patent at the US Patent & Trademark Office
Sandia National Laboratories - Visit the Intellectual Property Management and Licensing Website
A multi-chip module comprising a low-temperature co-fired ceramic substrate having a first side on which are mounted active components and a second side on which are mounted passive components, wherein this segregation of components allows for hermetically sealing the active components with a cover while leaving accessible the passive components, and wherein the passive components are secured using a reflow soldering technique and are removable and replaceable so as to make the multi-chip module substantially programmable with regard to the passive components.
Kautz; David (Lenexa, KS), Morgenstern; Howard (Lee's Summit, MO), Blazek; Roy J. (Overland Park, KS)
Honeywell Federal Manufacturing & Technologies (Kansas City, MO)
10/ 697,442
October 30, 2003
FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT PROGRAM The present invention was developed with support from the U.S. government under Contract No. DE-AC04-01AL66850 with the U.S. Department of Energy. Accordingly, the U.S. government has certain rights in the present invention.