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High thermal conductivity lossy dielectric using co-densified multilayer configuration

United States Patent

June 17, 2003
View the Complete Patent at the US Patent & Trademark Office
Oak Ridge National Laboratory - Visit the Partnerships Directorate Website
Systems and methods are described for loss dielectrics. A method of manufacturing a lossy dielectric includes providing at least one high dielectric loss layer and providing at least one high thermal conductivity-electrically insulating layer adjacent the at least one high dielectric loss layer and then densifying together. The systems and methods provide advantages because the lossy dielectrics are less costly and more environmentally friendly than the available alternatives.
Tiegs; Terry N. (Lenoir City, TN), Kiggans, Jr.; James O. (Oak Ridge, TN)
Lockheed Martin Energy Research Corporation (Oak Ridge, TN)
09/ 837,891
April 18, 2001
STATEMENT AS TO RIGHTS TO INVENTIONS MADE UNDER FEDERALLY-SPONSORED RESEARCH AND DEVELOPMENT This invention was made with Government support under contract No. DE-AC05-960R22464 awarded by the United States Department of Energy to Lockheed Martin Energy Research Corporation, and the Government has certain rights in this invention.