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Method and system for automated on-chip material and structural certification of MEMS devices

United States Patent

May 20, 2003
View the Complete Patent at the US Patent & Trademark Office
Sandia National Laboratories - Visit the Intellectual Property Management and Licensing Website
A new approach toward MEMS quality control and materials characterization is provided by a combined test structure measurement and mechanical response modeling approach. Simple test structures are cofabricated with the MEMS devices being produced. These test structures are designed to isolate certain types of physical response, so that measurement of their behavior under applied stress can be easily interpreted as quality control and material properties information.
Sinclair; Michael B. (Albuquerque, NM), DeBoer; Maarten P. (Albuquerque, NM), Smith; Norman F. (Albuquerque, NM), Jensen; Brian D. (Ann Arbor, MI), Miller; Samuel L. (Albuquerque, NM)
Sandia Corporation (Albuquerque, NM)
09/ 553,989
April 19, 2000
GOVERNMENT RIGHTS This invention was made with Government support under Contract DE-AC04-94AL85000 awarded by the U.S. Department of Energy. The Government has certain rights in the invention.