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Porous electrode apparatus for electrodeposition of detailed metal structures or microelectronic interconnections

United States Patent

March 12, 2002
View the Complete Patent at the US Patent & Trademark Office
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An apparatus and procedure for performing microfabrication of detailed metal structures by electroforming metal deposits within small cavities. Two primary areas of application are: the LIGA process which manufactures complex three-dimensional metal parts and the damascene process used for electroplating line and via interconnections of microelectronic devices. A porous electrode held in contact or in close proximity with a plating substrate or mold top to ensure one-dimensional and uniform current flow into all mold cavities is used. Electrolyte is pumped over the exposed surface of the porous electrode to ensure uniform ion concentrations at this external surface. The porous electrode prevents electrolyte circulation within individual mold cavities, avoiding preferential enhancement of ion transport in cavities having favorable geometries. Both current flow and ion transport are one-dimensional and identical in all mold cavities, so all metal deposits grow at the same rate eliminating nonuniformities of the prior art.
Griffiths; Stewart K. (Danville, CA), Nilson; Robert H. (Cardiff, CA), Hruby; Jill M. (Livermore, CA)
Sandia Corporation (Livermore, CA)
09/ 459,008
December 10, 1999
STATEMENT OF GOVERNMENT INTEREST The United States Government has rights in this invention pursuant to Contract No.DE-AC04-94AL85000 between the United States Department of Energy and the Sandia Corporation for the operation of the Sandia National Laboratories.