Skip to Content
Find More Like This
Return to Search

Method of making thermally removable polymeric encapsulants

United States Patent

August 7, 2001
View the Complete Patent at the US Patent & Trademark Office
Sandia National Laboratories - Visit the Intellectual Property Management and Licensing Website
A method of making a thermally-removable encapsulant by heating a mixture of at least one bis(maleimide) compound and at least one monomeric tris(furan) or tetrakis(furan) compound at temperatures from above room temperature to less than approximately C. to form a gel and cooling the gel to form the thermally-removable encapsulant. The encapsulant can be easily removed within approximately an hour by heating to temperatures greater than approximately C., preferably in a polar solvent. The encapsulant can be used in protecting electronic components that may require subsequent removal of the encapsulant for component repair, modification or quality control.
Small; James H. (Santa Fe, NM), Loy; Douglas A. (Albuquerque, NM), Wheeler; David R. (Albuquerque, NM), McElhanon; James R. (Albuquerque, NM), Saunders; Randall S. (late of Albuquerque, NM)
Sandia Corporation (Albuquerque, NM)
09/ 484,838
January 18, 2000
This invention was made with Government support under Contract No. DE-AC04-94AL85000 awarded by the Department of Energy. The Government has certain rights in the invention.