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Method for making electronic circuits having NiAl and Ni3Al substrates

United States Patent

January 30, 2001
View the Complete Patent at the US Patent & Trademark Office
Oak Ridge National Laboratory - Visit the Partnerships Directorate Website
A method for making electronic circuit component having improved mechanical properties and thermal conductivity comprises steps of providing NiAl and/or Ni.sub.3 Al, and forming an alumina layer thereupon prior to applying the conductive elements. Additional layers of copper-aluminum alloy or copper further improve mechanical strength and thermal conductivity.
Deevi; Seetharama C. (Midlothian, VA), Sikka; Vinod K. (Oak Ridge, TN)
UT-Battelle, LLC (Oak Ridge, TN)
09/ 260,124
March 2, 1999
The United States Government has rights in this invention pursuant to contract no. DE-AC05-84OR21400 between the United States Department of Energy and Lockheed Martin Energy Systems, Inc.