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Substrate system for spray forming

United States Patent

October 24, 2000
View the Complete Patent at the US Patent & Trademark Office
A substrate system for receiving a deposit of sprayed metal droplets including a movable outer substrate on which the sprayed metal droplets are deposited. The substrate system also includes an inner substrate disposed adjacent the outer substrate where the sprayed metal droplets are deposited on the outer substrate. The inner substrate includes zones of differing thermal conductivity to resist substrate layer porosity and to resist formation of large grains and coarse constituent particles in a bulk layer of the metal droplets which have accumulated on the outer substrate. A spray forming apparatus and associated method of spray forming a molten metal to form a metal product using the substrate system of the invention is also provided.
Chu; Men G. (Export, PA), Chernicoff; William P. (Harrisburg, PA)
Aluminum Company of America (Pittsburgh, PA)
09/ 035,218
March 5, 1998
The Government of the United States of America has rights in this invention pursuant to Contract No. DE-FC07-94ID 1323 awarded by the U.S. Department of Energy.