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Reduction of particle deposition on substrates using temperature gradient control

United States Patent

August 29, 2000
View the Complete Patent at the US Patent & Trademark Office
Sandia National Laboratories - Visit the Intellectual Property Management and Licensing Website
A method of reducing particle deposition during the fabrication of microelectronic circuitry is presented. Reduction of particle deposition is accomplished by controlling the relative temperatures of various parts of the deposition system so that a large temperature gradient near the surface on which fabrication is taking place exists. This temperature gradient acts to repel particles from that surface, thereby producing cleaner surfaces, and thus obtaining higher yields from a given microelectronic fabrication process.
Rader; Daniel J. (Albuquerque, NM), Dykhuizen; Ronald C. (Albuquerque, NM), Geller; Anthony S. (Albuquerque, NM)
Sandia Corporation (Albuquerque, NM)
08/ 537,192
September 29, 1995
This invention was made with Government support under Contract DE-AC04-94AL85000 awarded by the U.S. Department of Energy. The Government has certain rights in the invention.