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Epoxy bond and stop etch fabrication method

United States Patent

August 29, 2000
View the Complete Patent at the US Patent & Trademark Office
Sandia National Laboratories - Visit the Intellectual Property Management and Licensing Website
A class of epoxy bond and stop etch (EBASE) microelectronic fabrication techniques is disclosed. The essence of such techniques is to grow circuit components on top of a stop etch layer grown on a first substrate. The first substrate and a host substrate are then bonded together so that the circuit components are attached to the host substrate by the bonding agent. The first substrate is then removed, e.g., by a chemical or physical etching process to which the stop etch layer is resistant. EBASE fabrication methods allow access to regions of a device structure which are usually blocked by the presence of a substrate, and are of particular utility in the fabrication of ultrafast electronic and optoelectronic devices and circuits.
Simmons; Jerry A. (Sandia Park, NM), Weckwerth; Mark V. (Pleasanton, CA), Baca; Wes E. (Albuquerque, NM)
Sandia Corporation (Albuquerque, NM)
09/ 066,091
April 23, 1998
GOVERNMENT RIGHTS This invention was made with United States Government Support under Dept. of Energy Contract No. DE-AC04-94AL85000. The Government has certain rights in this invention.