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Method of using infrared radiation for assembling a first component with a second component

United States Patent

December 14, 1999
View the Complete Patent at the US Patent & Trademark Office
Oak Ridge National Laboratory - Visit the Partnerships Directorate Website
A method of assembling a first component for assembly with a second component involves a heating device which includes an enclosure having a cavity for inserting a first component. An array of infrared energy generators is disposed within the enclosure. At least a portion of the first component is inserted into the cavity, exposed to infrared energy and thereby heated to a temperature wherein the portion of the first component is sufficiently softened and/or expanded for assembly with a second component.
Sikka; Vinod K. (Oak Ridge, TN), Whitson; Barry G. (Corryton, TN), Blue; Craig A. (Knoxville, TN)
Lockheed Martin Energy Research Corporation (Oak Ridge, TN)
09/ 143,032
August 28, 1998
The United States Government has rights in this invention pursuant to contract no. DE-AC05-96OR22464 between the United States Department of Energy and Lockheed Martin Energy Research Corporation.