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Method of monolithic module assembly

United States Patent

October 26, 1999
View the Complete Patent at the US Patent & Trademark Office
Sandia National Laboratories - Visit the Intellectual Property Management and Licensing Website
Methods for "monolithic module assembly" which translate many of the advantages of monolithic module construction of thin-film PV modules to wafered c-Si PV modules. Methods employ using back-contact solar cells positioned atop electrically conductive circuit elements affixed to a planar support so that a circuit capable of generating electric power is created. The modules are encapsulated using encapsulant materials such as EVA which are commonly used in photovoltaic module manufacture. The methods of the invention allow multiple cells to be electrically connected in a single encapsulation step rather than by sequential soldering which characterizes the currently used commercial practices.
Gee; James M. (Albuquerque, NM), Garrett; Stephen E. (Albuquerque, NM), Morgan; William P. (Albuquerque, NM), Worobey; Walter (Albuquerque, NM)
Sandia Corporation (Albuquerque, NM)
08/ 994,177
December 19, 1997
GOVERNMENT RIGHTS The United States Government has rights in this invention pursuant to Contract No. DE-AC04-94AL85000 awarded by the U.S. Department of Energy.