Skip to Content
Find More Like This
Return to Search

Electronic circuits having NiAl and Ni.sub.3 Al substrates

United States Patent

October 12, 1999
View the Complete Patent at the US Patent & Trademark Office
Oak Ridge National Laboratory - Visit the Partnerships Directorate Website
An electronic circuit component having improved mechanical properties and thermal conductivity comprises NiAl and/or Ni.sub.3 Al, upon which an alumina layer is formed prior to applying the conductive elements. Additional layers of copper-aluminum alloy or copper further improve mechanical strength and thermal conductivity.
Deevi; Seetharama C. (Midlothian, VA), Sikka; Vinod K. (Oak Ridge, TN)
Lockheed Martin Energy Research Corporation (Oak Ridge, TN)
08/ 969,665
November 13, 1997
The United States Government has rights in this invention pursuant to contract no. DE-AC05-84OR21400 between the United States Department of Energy and Lockheed Martin Energy Systems, Inc.