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LED array and method for fabricating same

United States Patent Application

View the Complete Application at the US Patent & Trademark Office
A light emitting device or array comprising a submount having a top surface, a bottom surface and a plurality of edges, with input and output terminals disposed on the top surface. A plurality of attach pads and traces are also disposed on the top surface and electrically connected between the input and output terminals. A plurality of LEDs are also included, each of which is mounted to one of the attach pads. The attach pads cover more of the top surface than the LEDs and spread heat from the LEDs to the top surface of the submount. A plurality of lenses are also included each of which is molded over a respective one of the attach pads and covers the LED mounted to the particular attach pad. The arrays are shaped and arranged so that they can be easily attached to similar arrays in a tiling fashion, with the desired number of arrays included to meet the desired lighting requirements. Methods for fabricating the arrays from a single submount or submounts panel are also disclosed.
Yuan, Thomas Cheng-Hsin (Ventura, CA), Keller, Bernd (Santa Barbara, CA)
11/ 982,276
October 31, 2007
[0002] The invention was made with Government support under Department of Energy Contract No. DE-FC26-05NT42340. The Government has certain rights in this invention.