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United States Patent Application

View the Complete Application at the US Patent & Trademark Office
The present invention provides methods, devices and device components for fabricating patterns on substrate surfaces, particularly patterns comprising structures having microsized and/or nanosized features of selected lengths in one, two or three dimensions and including relief and recess features with variable height, depth or height and depth. Composite patterning devices comprising a plurality of polymer layers each having selected mechanical and thermal properties and physical dimensions provide high resolution patterning on a variety of substrate surfaces and surface morphologies. Gray-scale ink lithography photomasks for gray-scale pattern generation or molds for generating embossed relief features on a substrate surface are provided. The particular shape of the fabricated patterned can be manipulated by varying the three-dimensional recess pattern on an elastomeric patterning device which is brought into conformal contact with a substrate to localize patterning agent to the recess portion of the pattern.
Rogers, John A. (Champaign, IL), Menard, Etienne (Urbana, IL)
11/ 675,659
February 16, 2007
STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT [0002] This invention was made, at least in part, with United States governmental support awarded by Department of Energy Grant DEFG02-91ER45439 and AF SARNOFF 4900000182 awarded by DARPA. The United States Government has certain rights in this invention