Skip to Content
Return to Search

Cooling System for Electronic Components

United States Patent Application

*** PATENT GRANTED ***
20100254089
9,342,121
A1
View the Complete Application at the US Patent & Trademark Office
Embodiments of the present invention provide for non interruptive fluid cooling of an electronic enclosure. One or more electronic component packages may be removable from a circuit card having a fluid flow system. When installed, the electronic component packages are coincident to and in a thermal relationship with the fluid flow system. If a particular electronic component package becomes non-functional, it may be removed from the electronic enclosure without affecting either the fluid flow system or other neighboring electronic component packages.
Anderl, William James (Rochester, MN), Colgan, Evan George (Chestnut Ridge, NY), Gerken, James Dorance (Zumbro Falls, MN), Marroquin, Christopher Michael (Rochester, MN), Tian, Shurong (Mount Kisco, NY)
INTERNATIONAL BUSINESS MACHINES CORPORATION (Armonk NY)
12/ 417,921
April 3, 2009
[0002] This invention was made with Government support under Contract No.: B554331 awarded by Department of Energy. The Government has certain rights in this invention.