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System configured for applying a modifying agent to a non-equidimensional substrate

United States Patent Application

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The present invention is related to systems and methods for modifying various non-equidimensional substrates with modifying agents. The system comprises a processing chamber configured for passing the non-equidimensional substrate therethrough, wherein the processing chamber is further configured to accept a treatment mixture into the chamber during movement of the non-equidimensional substrate through the processing chamber. The treatment mixture can comprise of the modifying agent in a carrier medium, wherein the carrier medium is selected from the group consisting of a supercritical fluid, a near-critical fluid, a superheated fluid, a superheated liquid, and a liquefied gas. Thus, the modifying agent can be applied to the non-equidimensional substrate upon contact between the treatment mixture and the non-equidimensional substrate.
Janikowski, Stuart K. (Idaho Falls, ID), Argyle, Mark D. (Idaho Falls, ID), Fox, Robert V. (Idaho Falls, ID), Propp, W. Alan (Idaho Falls, ID), Toth, William J. (Idaho Falls, ID), Ginosar, Daniel M. (Idaho Falls, ID), Allen, Charles A. (Idaho Falls, ID), Miller, David L. (Idaho Falls, ID)
10/ 627,530
July 24, 2003
[0002] This invention was made with United States Government support under Contract No. DE-AC07-94ID13223, now Contract No. DE-AC07-99ID13727 awarded by the United States Department of Energy. The United States Government has certain rights in the invention.