Y-12 worker elevates object for positioning inside the IR Debonder. Top and front door of apparatus have been removed for better viewing of bottom-loading.
Infrared (IR) Debonding is a dry, nondestructive method of using heat to separate components joined by adhesives. The method has many permutations, lending itself in separating a myriad of different materials bonded by a wide variety of substances. The technology involves the use of a portable IR apparatus within which debonding is accomplished.Description
Y-12 invites interested companies to license its patented IR Debonder. This technology facilitates nondestructive disassembly and is safer and better for the environment than debonding techniques currently in use.
• Eliminates most mechanical processing
• Applies directional heat, without the use of a susceptor
• Can be easily repositioned and located
• Designed to be operated with minimum physical effort
• IR heating is instantaneous and rapid, shortening schedules
• Uses less energy than conventional methods, minimizing costs
• Debonded items can be easily removed from the apparatus, allowing quicker processing
• Physical activity required is minimized, eliminating many hazards to workersApplications and Industries• Dismantlement and salvage operations
• Repair operations involving defective components
• Component recovery
• Manufacturing quality controlMore Information
Inventors - Ronald F. Simandl, Steven W. Russell, Jerrid S. Hold, and John D. Brown
Patents and Patent Applications
|Title and Abstract||
Non-destructive component separation using infrared radiant energy
A method for separating a first component and a second component from one another at an adhesive bond interface between the first component and second component. Typically the method involves irradiating the first component with infrared radiation from a source that radiates substantially only short wavelengths until the adhesive bond is destabilized, and then separating the first component and the second component from one another. In some embodiments an assembly of components to be debonded is placed inside an enclosure and the assembly is illuminated from an IR source that is external to the enclosure. In some embodiments an assembly of components to be debonded is simultaneously irradiated by a multi-planar array of IR sources. Often the IR radiation is unidirectional. In some embodiments the IR radiation is narrow-band short wavelength infrared radiation.
|Y-12 National Security Complex||03/01/2011
|Technology ID||Development Stage||Availability||Published||Last Updated|
|2082||Production - TRL 9 – Actual application of the techology in its final form.||Available||05/03/2011||09/12/2011|