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Lubricated Mechanical Nanopolishing and Motor Oil for Self-Healing Metals and Ceramics

Ames Laboratory

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Technology Marketing Summary
 
Iowa State University and Ames Laboratory researchers have developed a process to produce extremely flat and smooth surfaces on hard materials without involving a chemical etchant.
Description
 
Chemical mechanical polishing (CMP) is a process used to create defect-free, smooth and flat surfaces, primarily for the semiconductor industry, and involves both mechanical polishing and chemical etching. CMP slurries (which provide the physical interface between the sample and the polishing equipment) typically consist of an abrasive (most often a metal oxide such as silica, ceria, alumina or zirconia), a liquid medium (normally water, but can be others depending on the application), and chemical agents (oxidizers, bases, acids) which treat the surface.
By tweaking the abrasive composition and size as well as the liquid medium, this technology removes the need for a chemical agent and can provide a nearly atomically flat surface. Through multiple steps, this process can create much flatter and smoother surfaces than produced using commercial materials (rough mean square roughness of 0.314nm versus 0.753nm for conventional polishing).
Benefits
 
• A 2 to 3 fold increase in surface smoothness
• Applicable to many hard surfaces
• May be extended to internal combustion engine lubricants
• May increase energy efficiency in treated engines
 
 
Applications and Industries
 
Semiconductor manufacture and internal combustion engine lubricants
More Information

Patent Applied for.

ISURF Direct Link: http://isurftech.technologypublisher.com/technology/20754

Technology Status
Technology IDDevelopment StageAvailabilityPublishedLast Updated
4333PrototypeAvailable12/06/201712/06/2017

Contact AMES About This Technology

To: Craig Forney<licensing@iastate.edu>