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Microsystems R&D and Fabrication

Sandia National Laboratories

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Technology Marketing Summary

Sandia National Laboratories (Sandia) seeks parties interested in utilizing world-class facilities to advance the "state-of-the-art" in microsystems research and development and fabrication.  

Description

The MESA complex integrates the numerous scientific disciplines necessary to produce functional, robust, integrated microsystems and represents the center of Sandia's investment in microsystems research, development, and prototyping activities.  This suite of facilities encompasses approximately 400,000 square feet and includes cleanroom facilities, laboratories and offices enabling microfabrication for scientific and engineering research, technology advancement and maturation, and small-lot, fast-turn prototyping.  Sandia's MicroFab is designed for flexibility, allowing the development of a range of III-V compound semiconductor-based optoelectronic, RF, photonic and sensor microsystem technologies.  Reconfigurable tools, many with little or no hardware changes required, allow for the processing of wafer pieces and full wafers up to six inch.  All 180 tools available in the MicroFab are maintained and supported by our in-house maintenance and technical staff.  We prototype design and process alternatives and perform highly customized, low-volume production with our flexible processing capabilities.

Benefits
  • Reconfigurable tools
  • Process wafer pieces and full wafers up to six inch
  • All 180 tools maintained and supported by in-house maintenance and technical staff
  • Perform highly customized, low-volume production with flexible processing capabilities
Applications and Industries

Key fabrication capabilities include:

  • Photolithography Processes (Coat/Expose/Develop)
  • Electron Beam (E-Beam) Lithography
  • Reactive Ion Etch
  • Wet Etch/Clean
  • Oxidation and Diffusion
  • Thin Films
  • Chemical Mechanical Polishing (CMP) for Planarization
  • Ion Implantation
  • Metrology
  • Deep Reactive Ion Etch (DRIE)
  • Electroplating
  • Packaging
  • MEMS Release
  • Yield Learning
  • Statistical Process Control
  • III-V Compound Semiconductor Epitaxial Growth
  • Mixed-Technology Integration and Processing
  • 3D Integration
  • Materials Characterization
  • Failure Analysis
  • Wafer Bonding and Thinning
More Information

For more information visit Sandia's Microsystems facilities webpage or view the following video.

Sandia has a current Federal Business Opportunities solicitation available to interested parties.

Technology Status
Development StageAvailabilityPublishedLast Updated
Proposed - Early stage R&DAvailable - Early stage R&D02/27/201402/27/2014

Contact SNL About This Technology

To: Patrick Finnegan<psfinne@sandia.gov>