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Adhesive bonding using variable frequency microwave energy

United States Patent

5,804,801
September 8, 1998
View the Complete Patent at the US Patent & Trademark Office
Oak Ridge National Laboratory - Visit the Partnerships Directorate Website
Methods of facilitating the adhesive bonding of various components with variable frequency microwave energy are disclosed. The time required to cure a polymeric adhesive is decreased by placing components to be bonded via the adhesive in a microwave heating apparatus having a multimode cavity and irradiated with microwaves of varying frequencies. Methods of uniformly heating various articles having conductive fibers disposed therein are provided. Microwave energy may be selectively oriented to enter an edge portion of an article having conductive fibers therein. An edge portion of an article having conductive fibers therein may be selectively shielded from microwave energy.
Lauf; Robert J. (Oak Ridge, TN), McMillan; April D. (Knoxville, TN), Paulauskas; Felix L. (Oak Ridge, TN), Fathi; Zakaryae (Cary, NC), Wei; Jianghua (Raleigh, NC)
Lambda Technologies, Inc. (Raleigh, NC), Lockheed Martin Energy Research Corporation (Oak Ridge, TN)
08/ 816,162
March 12, 1997
This invention was made with U.S. Government support under Contract No. DE-AC05-84OR21400 awarded by the U.S. Department of Energy to Martin Marietta Energy Systems, Inc. The U.S. Government has certain rights in this invention.