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Use of chemical mechanical polishing in micromachining

United States Patent

5,804,084
September 8, 1998
View the Complete Patent at the US Patent & Trademark Office
Sandia National Laboratories - Visit the Intellectual Property Management and Licensing Website
A process for removing topography effects during fabrication of micromachines. A sacrificial oxide layer is deposited over a level containing functional elements with etched valleys between the elements such that the sacrificial layer has sufficient thickness to fill the valleys and extend in thickness upwards to the extent that the lowest point on the upper surface of the oxide layer is at least as high as the top surface of the functional elements in the covered level. The sacrificial oxide layer is then polished down and planarized by chemical-mechanical polishing. Another layer of functional elements is then formed upon this new planarized surface.
Nasby; Robert D. (Albuquerque, NM), Hetherington; Dale L. (Albuquerque, NM), Sniegowski; Jeffry J. (Albuquerque, NM), McWhorter; Paul J. (Albuquerque, NM), Apblett; Christopher A. (Cedar Crest, NM)
Sandia Corporation (Albuquerque, NM)
08/ 729,122
October 11, 1996
This invention was made with Government support under Contract DE-AC04-94AL85000 awarded by the U.S. Department of Energy. The Government has certain rights in the invention.