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Method for integrating microelectromechanical devices with electronic circuitry

United States Patent

5,798,283
August 25, 1998
View the Complete Patent at the US Patent & Trademark Office
Sandia National Laboratories - Visit the Intellectual Property Management and Licensing Website
A method for integrating one or more microelectromechanical (MEM) devices with electronic circuitry. The method comprises the steps of forming each MEM device within a cavity below a device surface of the substrate; encapsulating the MEM device prior to forming electronic circuitry on the substrate; and releasing the MEM device for operation after fabrication of the electronic circuitry. Planarization of the encapsulated MEM device prior to formation of the electronic circuitry allows the use of standard processing steps for fabrication of the electronic circuitry.
Montague; Stephen (Albuquerque, NM), Smith; James H. (Albuquerque, NM), Sniegowski; Jeffry J. (Albuquerque, NM), McWhorter; Paul J. (Albuquerque, NM)
Sandia Corporation (Albuquerque, NM)
08/ 524,700
September 6, 1995
This invention was made with Government support under Contract No. DE-AC04-94AL85000 awarded by the U.S. Department of Energy. The Government has certain rights in the invention.