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Package for integrated optic circuit and method

United States Patent

5,790,730
August 4, 1998
View the Complete Patent at the US Patent & Trademark Office
Sandia National Laboratories - Visit the Intellectual Property Management and Licensing Website
A structure and method for packaging an integrated optic circuit. The package comprises a first wall having a plurality of microlenses formed therein to establish channels of optical communication with an integrated optic circuit within the package. A first registration pattern is provided on an inside surface of one of the walls of the package for alignment and attachment of the integrated optic circuit. The package in one embodiment may further comprise a fiber holder for aligning and attaching a plurality of optical fibers to the package and extending the channels of optical communication to the fibers outside the package. In another embodiment, a fiber holder may be used to hold the fibers and align the fibers to the package. The fiber holder may be detachably connected to the package.
Kravitz; Stanley H. (Placitas, NM), Hadley; G. Ronald (Albuquerque, NM), Warren; Mial E. (Albuquerque, NM), Carson; Richard F. (Albuquerque, NM), Armendariz; Marcelino G. (Albuquerque, NM)
08/ 336,902
November 10, 1994
This invention was made with Government support under Contract No. DE-AC0494AL85000 awarded by the U.S. Department of Energy. The Government has certain rights in the invention.