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High power RF window deposition apparatus, method, and device

United States Patent

9,698,454
July 4, 2017
View the Complete Patent at the US Patent & Trademark Office
A process for forming a coating for an RF window which has improved secondary electron emission and reduced multipactor for high power RF waveguides is formed from a substrate with low loss tangent and desirable mechanical characteristics. The substrate has an RPAO deposition layer applied which oxygenates the surface of the substrate to remove carbon impurities, thereafter has an RPAN deposition layer applied to nitrogen activate the surface of the substrate, after which a TiN deposition layer is applied using Titanium tert-butoxide. The TiN deposition layer is capped with a final RPAN deposition layer of nitridation to reduce the bound oxygen in the TiN deposition layer. The resulting RF window has greatly improved titanium layer adhesion, reduced multipactor, and is able to withstand greater RF power levels than provided by the prior art.
Ives; R. Lawrence (San Mateo, CA), Lucovsky; Gerald (Cary, NC), Zeller; Daniel (Scottsdale, CA)
Calabazas Creek Research, Inc. (San Mateo, CA)
13/ 937,216
July 9, 2013
The present invention was developed under Department of Energy grant #DE-SC0004571. The government has certain rights in this invention.