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Near-chip compliant layer for reducing perimeter stress during assembly process

United States Patent

9,570,373
February 14, 2017
View the Complete Patent at the US Patent & Trademark Office
A heat source (single semiconductor chip or group of closely spaced semiconductor chips of similar height) is provided on a first side of a substrate, which substrate has on said first side a support member comprising a compressible material. A heat removal component, oriented at an angle to said heat source, is brought into proximity of said heat source such that said heat removal component contacts said support member prior to contacting said heat source. Said heat removal component is assembled to said heat source such that said support member at least partially absorbs global inequality of force that would otherwise be applied to said heat source, absent said support member comprising said compressible material.
Schultz; Mark D. (Ossining, NY), Takken; Todd E. (Brewster, NY), Tian; Shurong (Mount Kisco, NY), Yao; Yuan (Tarrytown, NY)
INTERNATIONAL BUSINESS MACHINES CORPORATION (Armonk, NY)
14/ 963,466
December 9, 2015
STATEMENT OF GOVERNMENT RIGHTS This invention was made with Government support under Contract No.: B604142 awarded by the Department of Energy. The Government has certain rights in this invention.