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Provisioning cooling elements for chillerless data centers

United States Patent

9,521,787
December 13, 2016
View the Complete Patent at the US Patent & Trademark Office
Systems and methods for cooling include one or more computing structure, an inter-structure liquid cooling system that includes valves configured to selectively provide liquid coolant to the one or more computing structures; a heat rejection system that includes one or more heat rejection units configured to cool liquid coolant; and one or more liquid-to-liquid heat exchangers that include valves configured to selectively transfer heat from liquid coolant in the inter-structure liquid cooling system to liquid coolant in the heat rejection system. Each computing structure further includes one or more liquid-cooled servers; and an intra-structure liquid cooling system that has valves configured to selectively provide liquid coolant to the one or more liquid-cooled servers.
Chainer; Timothy J. (Putnam Valley, NY), Parida; Pritish R. (Fishkill, NY)
International Business Machines Corporation (Armonk, NY)
13/ 439,433
20130264045
April 4, 2012
GOVERNMENT RIGHTS This invention was made with Government support under Contract No.: DE-EE0002894 (Department of Energy). The government has certain rights in this invention.