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Low-temperature nanosolders

United States Patent

October 11, 2016
View the Complete Patent at the US Patent & Trademark Office
Sandia National Laboratories - Visit the Intellectual Property Management and Licensing Website
A nanosolder comprises a first metal nanoparticle core coated with a second metal shell, wherein the first metal has a higher surface energy and smaller atomic size than the second metal. For example, a bimetallic nanosolder can comprise a protective Ag shell "glued" around a reactive Cu nanoparticle. As an example, a 3-D epitaxial Cu-core and Ag-shell structure was generated from a mixture of copper and silver nanoparticles in toluene at temperatures as low as C.
Boyle; Timothy J. (Albuquerque, NM), Lu; Ping (Albuquerque, NM), Vianco; Paul T. (Albuquerque, NM), Chandross; Michael E. (Albuquerque, NM)
Sandia Corporation (Albuquerque, NM)
14/ 875,468
October 5, 2015
STATEMENT OF GOVERNMENT INTEREST This invention was made with Government support under contract no. DE-AC04-94AL85000 awarded by the U. S. Department of Energy to Sandia Corporation. The Government has certain rights in the invention.