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Modular jet impingement assemblies with passive and active flow control for electronics cooling

United States Patent

9,445,526
September 13, 2016
View the Complete Patent at the US Patent & Trademark Office
Power electronics modules having modular jet impingement assembly utilized to cool heat generating devices are disclosed. The modular jet impingement assemblies include a modular manifold having a distribution recess, one or more angled inlet connection tubes positioned at an inlet end of the modular manifold that fluidly couple the inlet tube to the distribution recess and one or more outlet connection tubes positioned at an outlet end of the modular manifold that fluidly coupling the outlet tube to the distribution recess. The modular jet impingement assemblies include a manifold insert removably positioned within the distribution recess and include one or more inlet branch channels each including an impinging slot and one or more outlet branch channels each including a collecting slot. Further a heat transfer plate coupled to the modular manifold, the heat transfer plate comprising an impingement surface including an array of fins that extend toward the manifold insert.
Zhou; Feng (Ann Arbor, MI), Dede; Ercan Mehmet (Ann Arbor, MI), Joshi; Shailesh (Ann Arbor, MI)
Toyota Motor Engineering & Manufacturing North America, Inc. (Erlanger, KY)
14/ 578,906
December 22, 2014
STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT This invention was made with government support under Cooperative Agreement DE-EE0006429 awarded by the United States Department of Energy. The government has certain rights in the invention.