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Method for reworkable packaging of high speed, low electrical parasitic power electronics modules through gate drive integration

United States Patent

August 2, 2016
View the Complete Patent at the US Patent & Trademark Office
A multichip power module directly connecting the busboard to a printed-circuit board that is attached to the power substrate enabling extremely low loop inductance for extreme environments such as high temperature operation. Wire bond interconnections are taught from the power die directly to the busboard further enabling enable low parasitic interconnections. Integration of on-board high frequency bus capacitors provide extremely low loop inductance. An extreme environment gate driver board allows close physical proximity of gate driver and power stage to reduce overall volume and reduce impedance in the control circuit. Parallel spring-loaded pin gate driver PCB connections allows a reliable and reworkable power module to gate driver interconnections.
Passmore; Brandon (Fayetteville, AR), Cole; Zach (Fayetteville, AR), Whitaker; Bret (Fayetteville, AR), Barkley; Adam (Springdale, AR), McNutt; Ty (Farmington, AR), Lostetter; Alexander (Fayetteville, AR)
Cree Fayetteville, Inc. (Fayetteville, AR)
14/ 100,288
December 9, 2013
STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT This invention was made with government support under grant DE-AR0000111 awarded by the United States Department of Energy. The United States government has certain rights in the invention.