A system and method for interfacing large-area electronics with integrated circuit devices is provided. The system may be implemented in an electronic device including a large area electronic (LAE) device disposed on a substrate. An integrated circuit IC is disposed on the substrate. A non-contact interface is disposed on the substrate and coupled between the LAE device and the IC. The non-contact interface is configured to provide at least one of a data acquisition path or control path between the LAE device and the IC.
UNITED STATES GOVERNMENT RIGHTS
This invention was made with government support under Subaward from The Pennsylvania State University, Award No. 4349-PU-DOE-4261; Pennsylvania State University Prime Grant No. DE-EE0004261 awarded by the Department of Energy. The government has certain rights in this invention.