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Cooling apparatus with a resilient heat conducting member

United States Patent

June 14, 2016
View the Complete Patent at the US Patent & Trademark Office
A cooling structure including a thermally conducting central element having a channel formed therein, the channel being configured for flow of cooling fluid there through, a first pressure plate, and a first thermally conductive resilient member disposed between the thermally conducting central element and the first pressure plate, wherein the first pressure plate, the first thermally conductive resilient member, and the thermally conducting central element form a first heat transfer path.
Chainer; Timothy J. (Putnam Valley, NY), Parida; Pritish R. (Fishkill, NY), Schultz; Mark D. (Ossining, NY)
13/ 738,961
January 10, 2013
This invention was made with Government support under Contract No.: DE-EE0002894 (awarded by Department of Energy (DOE)). The Government has certain rights in this invention.