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Environmentally-assisted technique for transferring devices onto non-conventional substrates

United States Patent

May 10, 2016
View the Complete Patent at the US Patent & Trademark Office
A device fabrication method includes: (1) providing a growth substrate including an oxide layer; (2) forming a metal layer over the oxide layer; (3) forming a stack of device layers over the metal layer; (4) performing fluid-assisted interfacial debonding of the metal layer to separate the stack of device layers and the metal layer from the growth substrate; and (5) affixing the stack of device layers to a target substrate.
Lee; Chi-Hwan (Stanford, CA), Kim; Dong Rip (Palo Alto, CA), Zheng; Xiaolin (Stanford, CA)
The Board of Trustees of the Leland Stanford Junior University (Palo Alto, CA)
14/ 340,425
July 24, 2014
STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT This invention was made with Government support under contract 0826003 awarded by the National Science Foundation and under contract DE-SC0001060 awarded by the Department of Energy. The Government has certain rights in this invention.