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Electronic interconnects and devices with topological surface states and methods for fabricating same

United States Patent

9,331,020
May 3, 2016
View the Complete Patent at the US Patent & Trademark Office
An interconnect is disclosed with enhanced immunity of electrical conductivity to defects. The interconnect includes a material with charge carriers having topological surface states. Also disclosed is a method for fabricating such interconnects. Also disclosed is an integrated circuit including such interconnects. Also disclosed is a gated electronic device including a material with charge carriers having topological surface states.
Yazdani; Ali (Princeton, NJ), Ong; N. Phuan (Belle Mead, NJ), Cava; Robert J. (Princeton, NJ)
13/ 039,762
March 3, 2011
STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT This invention was made with government support under Grants #DMR-0704314 and DMR-0819860 awarded by the National Science Foundation; Grant #N00014-07-1-0348 awarded by the Office of Naval Research; Grant #DE-FG02-07ER46419 awarded by the Department of Energy and Grant #W911NF-07-1-0125 awarded by the Army Research Office. The government has certain rights in this invention.